141B foaming agent
According to the Montreal Protocol: HCFC-141b can be used in developed countries until 2010. Currently, the United States, Japan and other countries have restricted its use in advance. In developing countries such as China, the use period can be extended to 2040, and China has promised to advance it to 2030.
Its azeotrope with methanol, 141b MA, was developed mainly for the electronics industry. This feature is also suitable for cleaning and degreasing various metal and plastic precision parts and optical parts. It is designed to improve the cleaning power of polar pollutants and improve the volatilization characteristics of HCFC-141b solution.
Product Details
HCFC-141b (monofluorodichloroethane) is a high-purity liquid widely used in cleaning and solvent fields.
Because its damage to the ozone layer is 1/10 of CFC-113, it is designated as an ideal substitute for fully halogenated chlorofluorocarbons.
HCFC-141b is a widely used non-perhalogenated chlorofluorocarbon. Although its destructive effect on the ozone layer has been greatly reduced compared to fully halogenated chlorofluorocarbons, it can still cause damage to the ozone layer that is difficult to recover. As a result, its use is gradually being reduced around the world.
According to the Montreal Protocol: HCFC-141b can be used in developed countries until 2010. Currently, the United States, Japan and other countries have restricted its use in advance. In developing countries such as China, the use period can be extended to 2040, and China has promised to advance it to 2030.
Its azeotrope with methanol, 141b MA, was developed mainly for the electronics industry. This feature is also suitable for cleaning and degreasing various metal and plastic precision parts and optical parts. It is designed to improve the cleaning power of polar pollutants and improve the volatilization characteristics of HCFC-141b solution.
Aerospace technology, semiconductor packaging, electronic industry, optical components, precision hardware, medical equipment, carrier media, and other applications such as SMT, LCD, audio heads, magnetic materials, resin components, etc.
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